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eBOX671-517-FL Fanless Embedded System
Features:
- 7th/6th gen Intel® Core™ i7/i5/i3 & Celeron® processors (35W/65W)
- Intel® Q170 Chipset
- 2 x 260-pin DDR4 SO-DIMM, up to 32GB
- 2 x SATA HDD Drive Bay (max. up 15 mm height & RAID 0 & 1)
- 8-CH PoE Onboard
- 2 x Front-access SIM Slots
- Supports 6-in/2-out Isolated DIO
- Optional ignition feature supported
- Fanless and Wide Operating Temperatures from -40°F to +158°F
The eBOX671-517-FL Fanless Embedded System is a powerful and versatile solution designed for demanding industrial applications. It is equipped with 7th/6th gen Intel® Core™ i7/i5/i3 & Celeron® processors (35W/65W) and Intel® Q170, ensuring high-performance computing capabilities. This system stands out with its 8-CH PoE onboard, facilitating seamless integration with multiple devices and providing efficient power delivery. With 2 front-access SIM slots, it supports convenient and accessible connectivity options. The inclusion of 6-in/2-out isolated DIO enhances the system's flexibility for industrial automation applications. Operating effortlessly in extreme conditions, the eBOX671-517-FL offers an extended temperature range from -40°C to +70°C. Additionally, the optional ignition feature further extends its suitability for automotive and transportation applications, making it a robust and reliable solution for diverse industrial settings.
Barebone & Base Configurations
- Intel® Pentium® Processor G4400T (3M Cache, 2.90 GHz)
Up to Intel® Core™ i7 Processor (Optional) - 4GB DDR4 SO-DIMM Memory
- 250GB 2.5" SATA Solid State Drive
- 2 x RS-232/422/485
- 4 x USB 3.0, 2 x USB 2.0
- 8 x Gigabit PoE (IEEE 802.3af/802.3at) (Intel® I210-AT, max. up to 90W)
- 2 x Full-size PCIe Mini Card Slots
2 x Half-size PCIe Mini Card Slots
2 x SIM Card Slots - 1 x Isolated DIO
- TPM 2.0
- Built-in VGA, DVI-D, HDMI and Audio
- 24 VDC Power Input