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IPC960-525-FL Industrial Embedded PC with 8th/9th Gen Intel® Core™ i7/i5/i3 & Celeron® Processor


  • Supports LGA1151 Socket 9th/8th gen Intel® Core™ processor, up to 65W
  • 2 x DDR4 SO-DIMM, (Max. 64GB)
  • Intel® H310/Q370 Chipset
  • M.2 Key B slot for 5G wireless connection (optional)
  • Supports RAID 0,1 (Intel® Q370)
  • Supports Power-on delay function
  • Supports TPM 2.0
  • Supports AMT 12 (Intel® Q370)
  • Supports 2-slot/4-slot expansion kit for further expansion

The IPC960-525 is a new entry to the Fanless Embedded line of products. The embedded system is constructed with an extruded aluminum and a heavy duty cold-rolled steel. The motherboard is installed with options ranging from i3, i5, and i7 intel 8th or 9th generation processors. Additionally the Celeron processors of the same generation are also supported and all processors utilize the H310 and Q370 chipset. The two memory modules included can utilize DDR4-2400/2666 un-buffered SO-DIMM RAM, which in turn supports a maximum capacity of up to 64GB. In terms of power, the unit can run with a voltage range of 19V to 30V with a power adapter. The operating temperature can range from –10C to 60C. Expansion options are also available as there are 2 full sized PCIe mini card slots and 1 SIM card slot. RAID configurations are also available to the user if they desire as the Q370 chipset supports the RAID 0 and RAID 1 configuration.

Barebone & Base Configurations

IPC960-525-FL Fanless Embedded PC

  • Intel® Celeron® G4900T Processor (2M Cache, 2.90 GHz)
  • Up to Intel® Core i7 Processor
  • 4GB DDR4 SO-DIMM Memory
  • 1.0TB SATA 2.5" Hard Drive
  • 1x RS-232/422/485 (DB-9)
  • 4x USB3.1, 2x USB2.0, 1x USB 2.0 (Internal, 180D type A for license key, up to 30mm)
  • TPM2.0
  • Extension System I/O Module (Optional)
  • Built-in VGA and HDMI
  • Built-in 2x Gigabit LAN
  • 5G Wireless Version (Optional)
  • 24VDC Power Connector
  • 120W Power Adapter with 2 Bare Wires (Optional)
    230W Power Adapter with 2 Bare Wires (Optional)

Barebone Only: