Features:

• Intel® Core™ i3-10320 3.8 GHz (up to 4.6 GHz, quad-core, 65W TDP)
  Intel® Core™ i5-10500TE 2.3 GHz (up to 3.7 GHz, 6-core, 35W TDP)
  Intel® Core™ i7-10700TE 2.0 GHz (up to 4.4 GHz, 8-core, 35W TDP)
• Intel® Q470/Q470E chipset
• 2 x DDR4 SO-DIMM Memory (Max. 64GB)
• 1 x 2.5” SATA 6Gb/s HDD/SSD Bay
• 2 x M.2 Slots, 2280 M-key (PCle x2)
• 2 x 2.5GbE Ports
• Multiple USB Ports and Serial Ports
• Multiple Internal Expansion Boards for Flexible Selection
• Various Optional Backplanes and Chassis
• CE/FCC Compliant

The TANK-XM810 is a ruggedized industrial embedded system with a modular expansion interface. The TANK-XM810 is constructed with the Intel Q470/Q470E chipset dependent on the processor selection. The processor powering the system is a choice between the Intel® Core™ i3-10320 3.8 GHz (up to 4.6 GHz, quad-core, 65W TDP), Intel® Core™ i5-10500TE 2.3 GHz (up to 3.7 GHz, 6-core, 35W TDP), and the Intel® Core™ i7-10700TE 2.0 GHz (up to 4.4 GHz, 8-core, 35W TDP). The memory accompanying the processor is fitted into 2 x SO-DIMM DDR4 2933 MHz slots allowing a maximum capacity of 64GB. For storage capabilities the system has 1 x 2.5” SATA 6Gb/s HDD/SSD bay. As for the I/O interface, there are 6 USB 3.2 ports and 2 USB 2.0 ports allocated alongside 2 x RS232/422/485 COM ports. The expansion interface notably has 2 x 2280 M-key (PCle x2) slots and an optional expansion backplane. The power input for the system ranged from 12-28V DC and has an operating temperature of -40 to 60 degrees Celsius.